Research institution TECHCET recently released its outlook on the ALD/CVD precursor market, and the institution predicts that ƙ Metal dielectrics and low ƙ The semiconductor precursor market for dielectrics will resume growth in the second half of 2023.

The institution analyzed that the current slowdown in the ALD/CVD precursor market, as the core material for semiconductor thin film deposition processes, is mainly due to the decrease in storage semiconductor prices (DRAM and 3D NAND) and the decrease in operating rates of related suppliers.

It is expected that by 2024, the market will rebound from the current sluggish wafer production. With the mass production of 2nm and 3nm logic devices, the demand for logic class ICs at nodes below 45nm is expected to reach a compound annual growth rate of over 7% by 2027. In addition, the growth of logic ICs using more mask layers will drive the demand for metal and dielectric precursors related to patterning and low k. DRAM is also transitioning to the EUV process, and major global manufacturers are competing to expand 3D NAND to over 200 layers and continue to move towards higher layers. It is expected that more than 500 layers of products will appear by 2030, and the demand for high aspect ratio etching will continue to drive the development of the precursor material market.